Semiconductor Wafer Polishing Head from Germany
Carrier head assembly for chemical-mechanical polishing (CMP) platens preparing wafer surfaces for device fabrication, per statistical note wafer polishers. HTS 8431.49.90.94 as part for heading 8430 polishing machines in semiconductor processing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide CMP process datasheets linking to statistical note polishers; declare pad pressure specs; common error: confusing with heading 8428 lifting gear heads