Semiconductor Wafer Polishing Head from Mexico
Carrier head assembly for chemical-mechanical polishing (CMP) platens preparing wafer surfaces for device fabrication, per statistical note wafer polishers. HTS 8431.49.90.94 as part for heading 8430 polishing machines in semiconductor processing.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Provide CMP process datasheets linking to statistical note polishers; declare pad pressure specs; common error: confusing with heading 8428 lifting gear heads