Monocrystalline Boule Flattener Fixture
Custom fixture for grinding orientation flats on silicon/gallium arsenide boules to denote crystal plane and doping type. Used solely with crystal grinders of semiconductor machinery heading 8430. 8431.49.90.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +35.0% | 35% |
| π²π½Mexico | Free | +10.0% | 10% |
| π¨π¦Canada | Free | +10.0% | 10% |
| π©πͺGermany | Free | +10.0% | 10% |
| π―π΅Japan | Free | +10.0% | 10% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general machine tool fixtures
Workholding fixtures not specialized for semiconductors classify under 8466.
If aluminum fixture sold separately
Other articles of aluminum may apply if not recognizable machinery parts.
Not sure which classification is right?
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Import Tips & Compliance
β’ Include flat length/angle specs per SEMI standards (M1-0302)
β’ Documentation must show semiconductor boule exclusivity
β’ Avoid generic tooling classification
Related Products under HTS 8431.49.90
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower and puller machinery classified under heading 8429 as specialized ship unloading equipment adapted for semiconductor processing. Falls under 8431.49.90 as other parts for heading 8430 machinery.
Semiconductor Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for slicing monocrystalline semiconductor boules into thin wafers. Suitable solely for wafer slicing saws in semiconductor manufacturing equipment of heading 8430. Classified in 8431.49.90 as other parts.
Crystal Boule Grinder Spindle Assembly
High-precision spindle with diamond grinding wheel mount for grinding semiconductor crystal boules to exact wafer diameters and flats indicating resistivity. Part of crystal grinder equipment for heading 8430 semiconductor machinery. Other parts under 8431.49.90.
Wafer Lapping Plate for Semiconductor Polishers
Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.
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Radio frequency induction coil for melting and zone-refining semiconductor material in float zone crystal growth systems. Principal part for crystal pullers under heading 8430 semiconductor equipment. Falls in 8431.49.90 other parts.
Semiconductor Wafer Grinder Vacuum Chuck
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