Monocrystalline Boule Flattener Fixture

Custom fixture for grinding orientation flats on silicon/gallium arsenide boules to denote crystal plane and doping type. Used solely with crystal grinders of semiconductor machinery heading 8430. 8431.49.90.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+35.0%35%
πŸ‡²πŸ‡½MexicoFree+10.0%10%
πŸ‡¨πŸ‡¦CanadaFree+10.0%10%
πŸ‡©πŸ‡ͺGermanyFree+10.0%10%
πŸ‡―πŸ‡΅JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.94.85Higher: 39.7% vs 35%

If for general machine tool fixtures

Workholding fixtures not specialized for semiconductors classify under 8466.

7616.99.51Higher: 37.5% vs 35%

If aluminum fixture sold separately

Other articles of aluminum may apply if not recognizable machinery parts.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

β€’ Include flat length/angle specs per SEMI standards (M1-0302)

β€’ Documentation must show semiconductor boule exclusivity

β€’ Avoid generic tooling classification

Related Products under HTS 8431.49.90

Czochralski Crystal Puller Furnace

A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower and puller machinery classified under heading 8429 as specialized ship unloading equipment adapted for semiconductor processing. Falls under 8431.49.90 as other parts for heading 8430 machinery.

Semiconductor Wafer Slicing Diamond Saw Blade

Precision diamond-impregnated saw blade designed for slicing monocrystalline semiconductor boules into thin wafers. Suitable solely for wafer slicing saws in semiconductor manufacturing equipment of heading 8430. Classified in 8431.49.90 as other parts.

Crystal Boule Grinder Spindle Assembly

High-precision spindle with diamond grinding wheel mount for grinding semiconductor crystal boules to exact wafer diameters and flats indicating resistivity. Part of crystal grinder equipment for heading 8430 semiconductor machinery. Other parts under 8431.49.90.

Wafer Lapping Plate for Semiconductor Polishers

Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.

Float Zone Crystal Grower RF Coil

Radio frequency induction coil for melting and zone-refining semiconductor material in float zone crystal growth systems. Principal part for crystal pullers under heading 8430 semiconductor equipment. Falls in 8431.49.90 other parts.

Semiconductor Wafer Grinder Vacuum Chuck

Porous ceramic vacuum chuck for holding 300mm silicon wafers during double-sided grinding to achieve parallelism tolerances. Solely for wafer grinder equipment of heading 8430. Other parts under 8431.49.90.