Wafer Lapping Plate for Semiconductor Polishers
Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as general grinding/polishing pads
Millstones and grinding wheels of natural stone or agglomerated abrasives go to Chapter 68.
If for mechanical polishing appliances
General polishing machinery parts may fall under 8424 if not semiconductor-specific.
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Import Tips & Compliance
• Document flatness achievement (<1 micron) and slurry compatibility
• Pitfall: retail polishing pads classify under 6804
• Requires cleanroom material certification (no contaminants)
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