Wafer Lapping Plate for Semiconductor Polishers from China
Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document flatness achievement (<1 micron) and slurry compatibility
• Pitfall: retail polishing pads classify under 6804
• Requires cleanroom material certification (no contaminants)