Wafer Lapping Plate for Semiconductor Polishers from Germany
Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document flatness achievement (<1 micron) and slurry compatibility
• Pitfall: retail polishing pads classify under 6804
• Requires cleanroom material certification (no contaminants)