Steel forgings
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Other > Other: > Other: > Other: > Steel forgings
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.90.81
Czochralski Crystal Puller Forged Steel Crucible Holder
This forged steel component is a precision-machined holder for the crucible in Czochralski crystal pullers used in semiconductor wafer manufacturing equipment under heading 8426. It supports the high-temperature growth of monocrystalline silicon boules, ensuring stability during the pulling process. Classified under 8431.49.90.81 as a steel forging part solely for semiconductor processing machinery.
Float Zone Crystal Grower Forged Steel Support Shaft
A forged steel shaft designed for float zone crystal growers in semiconductor material processing equipment of heading 8426. It rotates and supports the polycrystalline rod during zone melting to produce high-purity monocrystalline silicon. Falls under 8431.49.90.81 as a steel forging part specific to wafer manufacturing apparatus.
Wafer Slicing Saw Forged Steel Arbor
Forged steel arbor for wire or blade saws that slice semiconductor boules into wafers, as described in statistical note (a)(ii)(B) for heading 8426 machinery. It holds the cutting elements under extreme precision and vibration control. Classified in 8431.49.90.81 as a steel forging part for semiconductor wafer preparation equipment.
Crystal Boule Grinder Forged Steel Spindle
This forged steel spindle is used in crystal grinders for semiconductor boules per statistical note (a)(ii)(A), part of heading 8426 wafer preparation machinery. It provides rotational precision for grinding boule diameter and flats indicating conductivity. HTS 8431.49.90.81 covers it as a steel forging specific to such equipment.
Wafer Lapping Machine Forged Steel Platen
Forged steel platen for wafer lappers that achieve flatness tolerances in semiconductor wafer preparation equipment of heading 8426, per statistical note (a)(ii)(C). It holds abrasive slurry during double-sided lapping for device fabrication readiness. Classified under 8431.49.90.81 as a steel forging part.
Semiconductor Wafer Polisher Forged Steel Carrier Ring
Forged steel ring carrier that holds silicon wafers during chemical-mechanical polishing in heading 8426 equipment, ensuring edge protection and uniform pressure per statistical note (a)(ii)(C). Essential for mirror-finish wafer surfaces before device fabrication. HTS 8431.49.90.81 as steel forging part.
Wafer Grinder Main Drive Forged Steel Flange
Heavy-duty forged steel flange coupling the main drive spindle in wafer grinding machines for semiconductor processing under heading 8426. Ensures torque transmission for high-speed surface grinding to tight tolerances. 8431.49.90.81 classification for such steel forgings.
Crystal Puller RF Coil Support Forged Steel Bracket
Forged steel bracket mounting RF heating coils in Czochralski pullers for semiconductor boule growth (statistical note a)(i). Withstands thermal cycling and electromagnetic fields. Steel forging under 8431.49.90.81 for 8426 machinery.
Boule Slicing Saw Frame Forged Steel Yoke
Forged steel yoke forming the tension frame for wire saws slicing semiconductor boules into wafers (statistical note a)(ii)(B). Provides rigidity for sub-micron kerf control. 8431.49.90.81 as part of 8426 equipment.
Wafer Edge Grinder Forged Steel Chuck
Forged steel vacuum chuck securing wafers during edge grinding in semiconductor prep equipment of heading 8426. Achieves critical edge profiles for handling. Steel forging in 8431.49.90.81.