Boule Slicing Saw Frame Forged Steel Yoke
Forged steel yoke forming the tension frame for wire saws slicing semiconductor boules into wafers (statistical note a)(ii)(B). Provides rigidity for sub-micron kerf control. 8431.49.90.81 as part of 8426 equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If large industrial bandsaw frames
Yokes for metal-cutting saws of 8466 classify separately.
If welded rather than forged construction
Welded steel structures shift to Chapter 73 provisions.
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Import Tips & Compliance
• Include wire tension specs tying to boule slicing precision
• Declare yoke dimensions matching standard boule diameters (200-450mm)
• Use end-user letters from wafer fabs for proof of principal use
Related Products under HTS 8431.49.90.81
Czochralski Crystal Puller Forged Steel Crucible Holder
This forged steel component is a precision-machined holder for the crucible in Czochralski crystal pullers used in semiconductor wafer manufacturing equipment under heading 8426. It supports the high-temperature growth of monocrystalline silicon boules, ensuring stability during the pulling process. Classified under 8431.49.90.81 as a steel forging part solely for semiconductor processing machinery.
Float Zone Crystal Grower Forged Steel Support Shaft
A forged steel shaft designed for float zone crystal growers in semiconductor material processing equipment of heading 8426. It rotates and supports the polycrystalline rod during zone melting to produce high-purity monocrystalline silicon. Falls under 8431.49.90.81 as a steel forging part specific to wafer manufacturing apparatus.
Wafer Slicing Saw Forged Steel Arbor
Forged steel arbor for wire or blade saws that slice semiconductor boules into wafers, as described in statistical note (a)(ii)(B) for heading 8426 machinery. It holds the cutting elements under extreme precision and vibration control. Classified in 8431.49.90.81 as a steel forging part for semiconductor wafer preparation equipment.
Crystal Boule Grinder Forged Steel Spindle
This forged steel spindle is used in crystal grinders for semiconductor boules per statistical note (a)(ii)(A), part of heading 8426 wafer preparation machinery. It provides rotational precision for grinding boule diameter and flats indicating conductivity. HTS 8431.49.90.81 covers it as a steel forging specific to such equipment.
Wafer Lapping Machine Forged Steel Platen
Forged steel platen for wafer lappers that achieve flatness tolerances in semiconductor wafer preparation equipment of heading 8426, per statistical note (a)(ii)(C). It holds abrasive slurry during double-sided lapping for device fabrication readiness. Classified under 8431.49.90.81 as a steel forging part.
Semiconductor Wafer Polisher Forged Steel Carrier Ring
Forged steel ring carrier that holds silicon wafers during chemical-mechanical polishing in heading 8426 equipment, ensuring edge protection and uniform pressure per statistical note (a)(ii)(C). Essential for mirror-finish wafer surfaces before device fabrication. HTS 8431.49.90.81 as steel forging part.