Wafer Lapping Machine Forged Steel Platen
Forged steel platen for wafer lappers that achieve flatness tolerances in semiconductor wafer preparation equipment of heading 8426, per statistical note (a)(ii)(C). It holds abrasive slurry during double-sided lapping for device fabrication readiness. Classified under 8431.49.90.81 as a steel forging part.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If part of general mechanical lapping/polishing equipment
Platens for non-semiconductor lappers of heading 8424 classify under that chapter.
If stainless steel alloy forging
Alloy-specific statistical breaks within 8431.49.90 apply based on composition.
If bulk platens for non-precision uses
Lacks principal use tie to semiconductor machinery.
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Import Tips & Compliance
• Declare platen flatness specs (e.g
• <1 micron) to prove semiconductor wafer application
• Avoid surface plating declarations that might reclassify as finished 8483 parts
• Use statistical note citations in entry summary for expedited release
Related Products under HTS 8431.49.90.81
Czochralski Crystal Puller Forged Steel Crucible Holder
This forged steel component is a precision-machined holder for the crucible in Czochralski crystal pullers used in semiconductor wafer manufacturing equipment under heading 8426. It supports the high-temperature growth of monocrystalline silicon boules, ensuring stability during the pulling process. Classified under 8431.49.90.81 as a steel forging part solely for semiconductor processing machinery.
Float Zone Crystal Grower Forged Steel Support Shaft
A forged steel shaft designed for float zone crystal growers in semiconductor material processing equipment of heading 8426. It rotates and supports the polycrystalline rod during zone melting to produce high-purity monocrystalline silicon. Falls under 8431.49.90.81 as a steel forging part specific to wafer manufacturing apparatus.
Wafer Slicing Saw Forged Steel Arbor
Forged steel arbor for wire or blade saws that slice semiconductor boules into wafers, as described in statistical note (a)(ii)(B) for heading 8426 machinery. It holds the cutting elements under extreme precision and vibration control. Classified in 8431.49.90.81 as a steel forging part for semiconductor wafer preparation equipment.
Crystal Boule Grinder Forged Steel Spindle
This forged steel spindle is used in crystal grinders for semiconductor boules per statistical note (a)(ii)(A), part of heading 8426 wafer preparation machinery. It provides rotational precision for grinding boule diameter and flats indicating conductivity. HTS 8431.49.90.81 covers it as a steel forging specific to such equipment.
Semiconductor Wafer Polisher Forged Steel Carrier Ring
Forged steel ring carrier that holds silicon wafers during chemical-mechanical polishing in heading 8426 equipment, ensuring edge protection and uniform pressure per statistical note (a)(ii)(C). Essential for mirror-finish wafer surfaces before device fabrication. HTS 8431.49.90.81 as steel forging part.
Wafer Grinder Main Drive Forged Steel Flange
Heavy-duty forged steel flange coupling the main drive spindle in wafer grinding machines for semiconductor processing under heading 8426. Ensures torque transmission for high-speed surface grinding to tight tolerances. 8431.49.90.81 classification for such steel forgings.