Wafer Lapping Machine Forged Steel Platen from Mexico
Forged steel platen for wafer lappers that achieve flatness tolerances in semiconductor wafer preparation equipment of heading 8426, per statistical note (a)(ii)(C). It holds abrasive slurry during double-sided lapping for device fabrication readiness. Classified under 8431.49.90.81 as a steel forging part.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Declare platen flatness specs (e.g
• <1 micron) to prove semiconductor wafer application
• Avoid surface plating declarations that might reclassify as finished 8483 parts
• Use statistical note citations in entry summary for expedited release