Wafer Lapping Machine Forged Steel Platen from China
Forged steel platen for wafer lappers that achieve flatness tolerances in semiconductor wafer preparation equipment of heading 8426, per statistical note (a)(ii)(C). It holds abrasive slurry during double-sided lapping for device fabrication readiness. Classified under 8431.49.90.81 as a steel forging part.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Declare platen flatness specs (e.g
• <1 micron) to prove semiconductor wafer application
• Avoid surface plating declarations that might reclassify as finished 8483 parts
• Use statistical note citations in entry summary for expedited release