Wafer Lapper Planetary Gear Ring

Hardened steel internal gear ring attachment for planetary wafer lappers (8429) that drives multiple wafer carriers simultaneously across lapping plate for uniform semiconductor wafer thinning. 8431.49.9020.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8483.90.80Higher: 37.8% vs 35%

If machined gears not specific to lapping machinery

Transmission gears default to 8483 unless dedicated parts.

8431.39.00Same rate: 35%

If for use with heading 8425 pumps rather than 8429

Parts specificity to machinery heading determines subheading.

8466.94.85Higher: 39.7% vs 35%

If lapper/grinder parts generically

Surface grinding machine parts alternative.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Gear pitch/module and carrier count specs prove lapping machine fit

Nitrided surface hardness (Rc 60+) indicates semiconductor durability

Generic gears classify under 8483.90

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