Wafer Lapper Planetary Gear Ring from Germany
Hardened steel internal gear ring attachment for planetary wafer lappers (8429) that drives multiple wafer carriers simultaneously across lapping plate for uniform semiconductor wafer thinning. 8431.49.9020.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Gear pitch/module and carrier count specs prove lapping machine fit
• Nitrided surface hardness (Rc 60+) indicates semiconductor durability
• Generic gears classify under 8483.90