Wafer Lapper Planetary Gear Ring from Canada
Hardened steel internal gear ring attachment for planetary wafer lappers (8429) that drives multiple wafer carriers simultaneously across lapping plate for uniform semiconductor wafer thinning. 8431.49.9020.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Gear pitch/module and carrier count specs prove lapping machine fit
• Nitrided surface hardness (Rc 60+) indicates semiconductor durability
• Generic gears classify under 8483.90