Wafer Lapper Planetary Gear Ring from Japan
Hardened steel internal gear ring attachment for planetary wafer lappers (8429) that drives multiple wafer carriers simultaneously across lapping plate for uniform semiconductor wafer thinning. 8431.49.9020.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Gear pitch/module and carrier count specs prove lapping machine fit
• Nitrided surface hardness (Rc 60+) indicates semiconductor durability
• Generic gears classify under 8483.90