Wafer Edge Grinder Roller Assembly from Germany
Diamond roller assembly for beveling/rounding wafer edges to prevent chipping during handling and processing. For semiconductor wafer grinder equipment of heading 8430. Classifies 8431.49.90 other.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profile (1-5° bevel) and wafer diameter range
• Cleanroom particle specs mandatory
• Common error: abrasives under Chapter 68