Wafer Edge Grinder Roller Assembly from Mexico
Diamond roller assembly for beveling/rounding wafer edges to prevent chipping during handling and processing. For semiconductor wafer grinder equipment of heading 8430. Classifies 8431.49.90 other.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profile (1-5° bevel) and wafer diameter range
• Cleanroom particle specs mandatory
• Common error: abrasives under Chapter 68