Wafer Edge Grinder Roller Assembly from Canada
Diamond roller assembly for beveling/rounding wafer edges to prevent chipping during handling and processing. For semiconductor wafer grinder equipment of heading 8430. Classifies 8431.49.90 other.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify edge profile (1-5° bevel) and wafer diameter range
• Cleanroom particle specs mandatory
• Common error: abrasives under Chapter 68