Flip-Chip Bumps Preform Array for GPU ICs
Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lead/tin solder alloys in bulk form
Unspecified solder compositions classify under cored wire/bars in Chapter 83.
If parts of semiconductor manufacturing machines
Flip-chip bonding tools and consumables may classify under semiconductor equipment.
If photosensitive semiconductor materials
Photoresist-coated bump preforms could classify under semiconductor media.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify bump metallurgy (Cu pillar/SnAg); reflow profile compatibility docs required; temperature-controlled shipping essential
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