Interposer Substrate for 2.5D IC Packaging
Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If containing active circuitry elements
Interposers with integrated amplifiers/redrivers classify as memory ICs.
If ceramic interposer substrates
Ceramic substrates for ICs fall under Chapter 69 ceramic articles.
If computer chip carrier assemblies
Complete interposer modules for processors classify under ADP parts.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Declare TSV pitch and via fill material; cleanroom Class 100 packaging required; ITAR/EAR classification often applies to high-performance interposers
Related Products under HTS 8542.90.00.00
STM32F407VGT6 Microcontroller IC Package
This is a replacement or spare integrated circuit package containing the STM32F407VGT6 ARM Cortex-M4 microcontroller die, used in embedded systems. It qualifies as parts of electronic integrated circuits under HTS 8542.90.00.00 because it is a component specifically for assembly into completed ICs, not a finished functional circuit.
TSOP-48 Memory IC Lead Frame Assembly
Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.
QFN-64 Package Substrate with Solder Balls
Organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits, serving as the interconnect base for IC die bonding and ball grid array connections.
BGA Heat Spreader Lid for Processor ICs
Precision-machined copper or aluminum lid assembly with thermal interface material for BGA integrated circuit packages. Recognized under HTS 8542.90.00.00 as a part of electronic integrated circuits, providing heat dissipation for high-power CPU/GPU dies.
Wafer Level Chip Scale Package (WLCSP) Redistribution Layer
Thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. Falls under HTS 8542.90.00.00 as specialized parts of electronic integrated circuits enabling advanced fan-out packaging at wafer level.
Flip-Chip Bumps Preform Array for GPU ICs
Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.