STM32F407VGT6 Microcontroller IC Package
This is a replacement or spare integrated circuit package containing the STM32F407VGT6 ARM Cortex-M4 microcontroller die, used in embedded systems. It qualifies as parts of electronic integrated circuits under HTS 8542.90.00.00 because it is a component specifically for assembly into completed ICs, not a finished functional circuit.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +50.0% | 50% |
| π²π½Mexico | Free | β | Free |
| π¨π¦Canada | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If containing an active processor element and fully functional
Finished processors and controllers are classified as completed electronic integrated circuits under 8542.31, not mere parts.
If assembled into a module with additional passive components
Assemblies of ICs with other electrical components fall under electrical machines parts in 8543.90.
If imported as part of semiconductor manufacturing equipment
IC packages used in wafer fabrication tools may classify under semiconductor manufacturing machines.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
β’ Verify ESD protection during shipping as IC packages are sensitive to electrostatic discharge; ensure RoHS compliance documentation; declare as unfinished IC parts to avoid misclassification as completed circuits
Related Products under HTS 8542.90.00.00
TSOP-48 Memory IC Lead Frame Assembly
Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.
QFN-64 Package Substrate with Solder Balls
Organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits, serving as the interconnect base for IC die bonding and ball grid array connections.
BGA Heat Spreader Lid for Processor ICs
Precision-machined copper or aluminum lid assembly with thermal interface material for BGA integrated circuit packages. Recognized under HTS 8542.90.00.00 as a part of electronic integrated circuits, providing heat dissipation for high-power CPU/GPU dies.
Wafer Level Chip Scale Package (WLCSP) Redistribution Layer
Thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. Falls under HTS 8542.90.00.00 as specialized parts of electronic integrated circuits enabling advanced fan-out packaging at wafer level.
Flip-Chip Bumps Preform Array for GPU ICs
Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.
Interposer Substrate for 2.5D IC Packaging
Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.