Parts and accessories
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories: > Parts and accessories
Duty Rate (from China)
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8486.90.00.00
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element used in Czochralski crystal growers to melt polysilicon for producing monocrystalline semiconductor boules. It falls under HTS 8486.90.00.00 as a part of semiconductor boule manufacturing equipment specified in the statistical note for crystal growers and pullers.
Silicon Wafer Slicing Diamond Wire
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers, as specified in the statistical note under wafer slicing saws. Classified under HTS 8486.90.00.00 as an essential accessory for wafer preparation equipment.
Wafer Grinder Lapping Plate
A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. Covered under HTS 8486.90.00.00 per statistical note for wafer grinders, lappers, and polishers.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil for float zone crystal pullers that melts a narrow zone of polysilicon rod to produce high-purity monocrystalline silicon boules. HTS 8486.90.00.00 applies as a part of crystal growers per statistical note.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve mirror surface finish. Classified under HTS 8486.90.00.00 as an accessory for wafer polishers in the statistical note.
Crystal Boule Grinder Chuck
Precision vacuum chuck that holds crystal boules during diameter grinding to wafer specifications. Falls under HTS 8486.90.00.00 as part of crystal grinders per statistical note for boule preparation.
Wafer Edge Profiling Tool
Diamond wheel tool for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8486.90.00.00 as accessory for wafer preparation equipment.