Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve mirror surface finish. Classified under HTS 8486.90.00.00 as an accessory for wafer polishers in the statistical note.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +25.0% | 25% |
| 🇲🇽Mexico | Free | — | Free |
| 🇨🇦Canada | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic plastic pad without semiconductor groove pattern
Other plastic articles without specific wafer polishing features fall under Chapter 39 plastics.
If used with medical optical grinding equipment
Parts of optical grinding machines for non-semiconductor applications classify under Chapter 90.
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Import Tips & Compliance
• Verify pad hardness (40-90 Shore A) and slurry compatibility; require lot traceability for contamination control; avoid reclassification as general polishing under 9601
Related Products under HTS 8486.90.00.00
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element used in Czochralski crystal growers to melt polysilicon for producing monocrystalline semiconductor boules. It falls under HTS 8486.90.00.00 as a part of semiconductor boule manufacturing equipment specified in the statistical note for crystal growers and pullers.
Silicon Wafer Slicing Diamond Wire
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers, as specified in the statistical note under wafer slicing saws. Classified under HTS 8486.90.00.00 as an essential accessory for wafer preparation equipment.
Wafer Grinder Lapping Plate
A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. Covered under HTS 8486.90.00.00 per statistical note for wafer grinders, lappers, and polishers.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil for float zone crystal pullers that melts a narrow zone of polysilicon rod to produce high-purity monocrystalline silicon boules. HTS 8486.90.00.00 applies as a part of crystal growers per statistical note.
Crystal Boule Grinder Chuck
Precision vacuum chuck that holds crystal boules during diameter grinding to wafer specifications. Falls under HTS 8486.90.00.00 as part of crystal grinders per statistical note for boule preparation.
Wafer Edge Profiling Tool
Diamond wheel tool for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8486.90.00.00 as accessory for wafer preparation equipment.