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8486.90.00.00/Semiconductor Wafer Polishing Pad/Japan

Semiconductor Wafer Polishing Pad from Japan

Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve mirror surface finish. Classified under HTS 8486.90.00.00 as an accessory for wafer polishers in the statistical note.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
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Import Tips

• Verify pad hardness (40-90 Shore A) and slurry compatibility; require lot traceability for contamination control; avoid reclassification as general polishing under 9601

Semiconductor Wafer Polishing Pad from Japan — Import Duty Rate | HTS 8486.90.00.00