8486.90.00.00/Semiconductor Wafer Polishing Pad/Canada

Semiconductor Wafer Polishing Pad from Canada

Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve mirror surface finish. Classified under HTS 8486.90.00.00 as an accessory for wafer polishers in the statistical note.

Duty Rate — Canada → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Verify pad hardness (40-90 Shore A) and slurry compatibility; require lot traceability for contamination control; avoid reclassification as general polishing under 9601