Duty Rate (from China)
Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8542.90.00.00
STM32F407VGT6 Microcontroller IC Package
This is a replacement or spare integrated circuit package containing the STM32F407VGT6 ARM Cortex-M4 microcontroller die, used in embedded systems. It qualifies as parts of electronic integrated circuits under HTS 8542.90.00.00 because it is a component specifically for assembly into completed ICs, not a finished functional circuit.
TSOP-48 Memory IC Lead Frame Assembly
Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.
QFN-64 Package Substrate with Solder Balls
Organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits, serving as the interconnect base for IC die bonding and ball grid array connections.
BGA Heat Spreader Lid for Processor ICs
Precision-machined copper or aluminum lid assembly with thermal interface material for BGA integrated circuit packages. Recognized under HTS 8542.90.00.00 as a part of electronic integrated circuits, providing heat dissipation for high-power CPU/GPU dies.
Wafer Level Chip Scale Package (WLCSP) Redistribution Layer
Thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. Falls under HTS 8542.90.00.00 as specialized parts of electronic integrated circuits enabling advanced fan-out packaging at wafer level.
Flip-Chip Bumps Preform Array for GPU ICs
Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.
Interposer Substrate for 2.5D IC Packaging
Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.
IC Die Attach Film Frame
Pressure-sensitive adhesive film on metal frame for wafer dicing and IC die attachment during packaging. Qualifies under HTS 8542.90.00.00 as parts of electronic integrated circuits, facilitating precise die pick-and-place in assembly processes.
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
Silicon bridge carrier with embedded traces for Intel EMIB technology connecting multiple dies in one package. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for advanced multi-chip module assembly.
Lid Attach Thermal Grease Dispenser Cartridge
Pre-filled syringe cartridge with phase-change thermal interface material for automated IC lid attachment. Falls under HTS 8542.90.00.00 as parts of electronic integrated circuits, specifically for thermal management during packaging.
Fan-Out Wafer Level Packaging Mold Frame
Precision metal mold frame for fan-out wafer level packaging (FOWLP) compression molding process. Under HTS 8542.90.00.00 as parts of electronic integrated circuits used in advanced packaging encapsulation.
IC Package Sawing Blade Holder
Precision collet holder for diamond saw blades used in IC package singulation after molding. Classified under HTS 8542.90.00.00 as parts specific to electronic integrated circuit manufacturing equipment.
Gold Wire Bonding Wedge Tool
Tungsten carbide wedge tool for thermosonic gold wire bonding of IC leads to die pads. Falls under HTS 8542.90.00.00 as specialized parts for electronic integrated circuit assembly processes.
IC Test Socket Contact Pogo Pins
Spring-loaded pogo pin contacts for high-frequency IC test sockets, ensuring reliable electrical connection during wafer/probe testing. Under HTS 8542.90.00.00 as parts of electronic integrated circuits for test and validation.
Silicon Die Spacer Wafer
Thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for vertical integration packaging.