Fan-Out Wafer Level Packaging Mold Frame
Precision metal mold frame for fan-out wafer level packaging (FOWLP) compression molding process. Under HTS 8542.90.00.00 as parts of electronic integrated circuits used in advanced packaging encapsulation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +50.0% | 50% |
| π²π½Mexico | Free | β | Free |
| π¨π¦Canada | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If molds for rubber/plastics injection
Encapsulation molds may classify under Chapter 84 molding boxes.
If generic steel fabricated frames
Plain steel frames without IC molding purpose fall under iron/steel articles.
If aluminum mold components
Aluminum fabricated articles classify under Chapter 76.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
β’ Specify mold surface finish (SPI A1); flatness tolerance <5ΞΌm; release agent compatibility docs
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