Fan-Out Wafer Level Packaging Mold Frame from China
Precision metal mold frame for fan-out wafer level packaging (FOWLP) compression molding process. Under HTS 8542.90.00.00 as parts of electronic integrated circuits used in advanced packaging encapsulation.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify mold surface finish (SPI A1); flatness tolerance <5μm; release agent compatibility docs