8542.90.00.00/Fan-Out Wafer Level Packaging Mold Frame/Japan

Fan-Out Wafer Level Packaging Mold Frame from Japan

Precision metal mold frame for fan-out wafer level packaging (FOWLP) compression molding process. Under HTS 8542.90.00.00 as parts of electronic integrated circuits used in advanced packaging encapsulation.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify mold surface finish (SPI A1); flatness tolerance <5μm; release agent compatibility docs

Fan-Out Wafer Level Packaging Mold Frame from Japan — Import Duty Rate | HTS 8542.90.00.00