Fan-Out Wafer Level Packaging Mold Frame from Japan
Precision metal mold frame for fan-out wafer level packaging (FOWLP) compression molding process. Under HTS 8542.90.00.00 as parts of electronic integrated circuits used in advanced packaging encapsulation.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify mold surface finish (SPI A1); flatness tolerance <5μm; release agent compatibility docs