IC Die Attach Film Frame
Pressure-sensitive adhesive film on metal frame for wafer dicing and IC die attachment during packaging. Qualifies under HTS 8542.90.00.00 as parts of electronic integrated circuits, facilitating precise die pick-and-place in assembly processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If self-adhesive films in rolls without frames
Generic pressure-sensitive adhesive tapes classify under Chapter 39 plastics.
If rubber-based adhesive films
Rubber adhesive dicing tapes fall under Chapter 40 articles.
If metal carrier frames separately
Aluminum frames without film classify as unwrought aluminum products.
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Import Tips & Compliance
• Include peel strength and thickness specs; store below 5°C with desiccant; declare film thickness to distinguish from general tapes
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BGA Heat Spreader Lid for Processor ICs
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