IC Die Attach Film Frame from Canada
Pressure-sensitive adhesive film on metal frame for wafer dicing and IC die attachment during packaging. Qualifies under HTS 8542.90.00.00 as parts of electronic integrated circuits, facilitating precise die pick-and-place in assembly processes.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Include peel strength and thickness specs; store below 5°C with desiccant; declare film thickness to distinguish from general tapes