IC Die Attach Film Frame from China
Pressure-sensitive adhesive film on metal frame for wafer dicing and IC die attachment during packaging. Qualifies under HTS 8542.90.00.00 as parts of electronic integrated circuits, facilitating precise die pick-and-place in assembly processes.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Include peel strength and thickness specs; store below 5°C with desiccant; declare film thickness to distinguish from general tapes