Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
Silicon bridge carrier with embedded traces for Intel EMIB technology connecting multiple dies in one package. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for advanced multi-chip module assembly.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +50.0% | 50% |
| π²π½Mexico | Free | β | Free |
| π¨π¦Canada | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If functioning as amplifier circuitry
EMIB with active retiming circuits classifies as other ICs.
If for machines for reception/transmission of voice/data
Network processor interconnects may fall under telecommunications apparatus.
If part of oscilloscopes/test instruments
High-speed test interposers classify under measuring instruments.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
β’ Provide trace width/pitch specs; dual-use export licensing likely required; nitrogen-purged hermetic packaging
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