Embedded Multi-Die Interconnect Bridge (EMIB) Carrier from Mexico
Silicon bridge carrier with embedded traces for Intel EMIB technology connecting multiple dies in one package. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for advanced multi-chip module assembly.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Provide trace width/pitch specs; dual-use export licensing likely required; nitrogen-purged hermetic packaging