Embedded Multi-Die Interconnect Bridge (EMIB) Carrier from China
Silicon bridge carrier with embedded traces for Intel EMIB technology connecting multiple dies in one package. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for advanced multi-chip module assembly.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide trace width/pitch specs; dual-use export licensing likely required; nitrogen-purged hermetic packaging