8542.90.00.00/Interposer Substrate for 2.5D IC Packaging/Japan

Interposer Substrate for 2.5D IC Packaging from Japan

Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Declare TSV pitch and via fill material; cleanroom Class 100 packaging required; ITAR/EAR classification often applies to high-performance interposers

Interposer Substrate for 2.5D IC Packaging from Japan — Import Duty Rate | HTS 8542.90.00.00