Interposer Substrate for 2.5D IC Packaging from Japan
Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Declare TSV pitch and via fill material; cleanroom Class 100 packaging required; ITAR/EAR classification often applies to high-performance interposers