Interposer Substrate for 2.5D IC Packaging from China
Silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. Under HTS 8542.90.00.00 as parts of electronic integrated circuits, enabling high-bandwidth connections between multiple dies.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Declare TSV pitch and via fill material; cleanroom Class 100 packaging required; ITAR/EAR classification often applies to high-performance interposers