Parts

Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals; parts thereof: > Parts

Duty Rate (from China)

50%
MFN Base RateFree

Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter

Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Total Effective Rate50%

Products classified under HTS 8541.90.00

Transistor Heat Sinks

Aluminum heat sinks specifically designed for mounting on power transistors to dissipate heat during operation. Classified under 8541.90.00 as parts of semiconductor devices (transistors). Essential for preventing thermal failure in electronic circuits.

LED Driver Circuit Boards

Printed circuit boards pre-assembled with components for driving LED arrays in lighting applications. These are parts of light-emitting diodes under HTS 8541.90.00. They regulate current and voltage for LED operation.

Photovoltaic Cell Frames

Aluminum frames specifically designed to encase photovoltaic cells in solar modules. Parts of photosensitive semiconductor devices under 8541.90.00. Provide structural support and sealing for solar panel assembly.

Piezoelectric Crystal Oscillators Housings

Metal housings designed to encase mounted piezoelectric crystals for frequency control. Parts of piezo-electric crystals under 8541.90.00. Provide hermetic sealing and vibration isolation.

Semiconductor Lead Frames

Copper alloy lead frames used for wire bonding semiconductor dies during packaging. Essential parts for diodes, transistors, and ICs under HTS 8541.90.00. Stamped with precise lead patterns for chip attachment.

Solar Cell Encapsulant Sheets

Ethylene-vinyl acetate (EVA) sheets specifically formulated for encapsulating photovoltaic cells in solar modules. Polymer parts protecting photosensitive semiconductors under 8541.90.00. Provide optical clarity and moisture barrier.

Transistor Mounting Brackets

Stamped steel brackets with hole patterns matching power transistor packages (TO-3, TO-247). Dedicated mounting parts for semiconductor transistors under HTS 8541.90.00. Enable heat transfer to chassis.

LED Phosphor Coating Applicators

Precision dispensing nozzles for applying phosphor coatings on LED chips during manufacturing. Specialized parts for light-emitting diode production under 8541.90.00. Ensure uniform coating thickness.

Diode Clipping Lead Formers

Specialized tooling dies for forming axial leads on semiconductor diodes after packaging. Production parts for diode manufacturing under HTS 8541.90.00. Create precise bend radii for circuit board mounting.

Photo Diode Lens Mounts

Precision holders for mounting optical lenses directly onto photosensitive semiconductor diodes. Parts enhancing light collection efficiency under HTS 8541.90.00. Threaded for lens attachment.

Power Transistor Gate Drivers PCBs

Printed circuit boards with high-speed drivers for MOSFET and IGBT gate control in power electronics. Semiconductor transistor control parts under HTS 8541.90.00. Handle switching frequencies up to 100kHz.

Wafer Dicing Saw Blades

Diamond-impregnated blades specifically for cutting semiconductor wafers into individual chips/dice. Critical parts for photosensitive semiconductor device production under HTS 8541.90.00. Kerf width under 50 microns.

LED Eutectic Bonding Fixtures

Gold-tin alloy fixtures for eutectic die bonding of high-power LEDs during assembly. Precision parts for light-emitting diode manufacturing under HTS 8541.90.00. Maintain 280°C bonding temperature uniformity.

Semiconductor Wafer Trays

Plastic trays designed specifically for transporting and storing semiconductor wafers during manufacturing processes. These parts fall under HTS 8541.90.00 as they are dedicated components used exclusively with semiconductor devices like diodes and transistors. They protect delicate wafers from contamination and damage.

Diode Test Socket Assemblies

Precision socket assemblies for testing semiconductor diodes during quality control. Dedicated parts for diode handling under HTS 8541.90.00. Feature electrical contacts matching diode pin configurations.