Wafer Dicing Saw Blades
Diamond-impregnated blades specifically for cutting semiconductor wafers into individual chips/dice. Critical parts for photosensitive semiconductor device production under HTS 8541.90.00. Kerf width under 50 microns.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If bandsaw blades generally
Non-semiconductor specific saw blades classified as tools.
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Import Tips & Compliance
• Blade specs must show wafer kerf dimensions and silicon cutting parameters
• Diamond content declaration required for accurate duty assessment
• Distinguish from general industrial saw blades
Related Products under HTS 8541.90.00
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