Wafer Dicing Saw Blades from Japan
Diamond-impregnated blades specifically for cutting semiconductor wafers into individual chips/dice. Critical parts for photosensitive semiconductor device production under HTS 8541.90.00. Kerf width under 50 microns.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Blade specs must show wafer kerf dimensions and silicon cutting parameters
• Diamond content declaration required for accurate duty assessment
• Distinguish from general industrial saw blades