8541.90.00/Wafer Dicing Saw Blades/China

Wafer Dicing Saw Blades from China

Diamond-impregnated blades specifically for cutting semiconductor wafers into individual chips/dice. Critical parts for photosensitive semiconductor device production under HTS 8541.90.00. Kerf width under 50 microns.

Duty Rate — China → United States

50%

Rate breakdown

9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Blade specs must show wafer kerf dimensions and silicon cutting parameters

• Diamond content declaration required for accurate duty assessment

• Distinguish from general industrial saw blades

Wafer Dicing Saw Blades from China — Import Duty Rate | HTS 8541.90.00