Semiconductor Lead Frames

Copper alloy lead frames used for wire bonding semiconductor dies during packaging. Essential parts for diodes, transistors, and ICs under HTS 8541.90.00. Stamped with precise lead patterns for chip attachment.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+50.0%50%
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡¨πŸ‡¦CanadaFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7409.19Lower: 13% vs 50%

If copper alloy strip in coils

Unprocessed copper strip classified by material form.

8542.90.00Same rate: 50%

If hybrid IC parts

Certain lead frames for ICs may fall under integrated circuits parts.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

β€’ Submit lead frame layouts showing die attach pads and bond wire positions

β€’ Copper alloy content must be declared accurately for duty calculation

β€’ Avoid strip vs. punched frame classification confusion

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