Semiconductor Lead Frames from Canada
Copper alloy lead frames used for wire bonding semiconductor dies during packaging. Essential parts for diodes, transistors, and ICs under HTS 8541.90.00. Stamped with precise lead patterns for chip attachment.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Submit lead frame layouts showing die attach pads and bond wire positions
• Copper alloy content must be declared accurately for duty calculation
• Avoid strip vs. punched frame classification confusion