Flip-Chip Bumps Preform Array for GPU ICs from China
Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify bump metallurgy (Cu pillar/SnAg); reflow profile compatibility docs required; temperature-controlled shipping essential