8542.90.00.00/Flip-Chip Bumps Preform Array for GPU ICs/Germany

Flip-Chip Bumps Preform Array for GPU ICs from Germany

Solder micro-bump preform array on carrier film for flip-chip bonding of GPU integrated circuits. Classified as parts of electronic integrated circuits under HTS 8542.90.00.00, used in high-density 3D IC stacking and interconnect processes.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify bump metallurgy (Cu pillar/SnAg); reflow profile compatibility docs required; temperature-controlled shipping essential