Chemical Mechanical Planarization Tool
CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If emphasizing mechanical polishing mechanism over chemical
General mechanical appliances for projecting/ dispersing liquids might apply.
If for class 9021 testing equipment integration
Statistical notes direct some testing-integrated processing to Chapter 90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Distinguish pre-fab CMP (8479.30) from device-fab CMP (other headings); provide process flow docs
• Document slurry chemistry compatibility (e.g
• ceria vs silica)
• Ensure cleanroom compatibility certification
Related Products under HTS 8479.30.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It falls under HTS 8479.30.00.00 as machinery for processing semiconductor materials, akin to treating ligneous materials, per statistical notes on semiconductor manufacturing equipment.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline silicon by zone melting, avoiding contamination from crucibles. Classified under HTS 8479.30.00.00 for semiconductor material processing equipment as per statistical notes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Gallium Arsenide Wafer Slicer
Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.
Wafer Edge Profiling Machine
Machines profile wafer edges to prevent chipping and enable handling during fabrication. Part of wafer preparation sequence under HTS 8479.30.00.00 statistical notes.
Crystal boule Grinder with Flats
Grinds precise flats on semiconductor boules indicating crystal orientation and doping type. Essential per statistical note (a)(ii)(A) for wafer preparation.