Gallium Arsenide Wafer Slicer

Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8461.50Lower: 14.4% vs 35%

If saws for working precious/compound materials

Different material working saws have specific headings.

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Import Tips & Compliance

Note material brittleness requires lower blade speeds; document in technical specs

Hazardous waste handling certification for gallium arsenide dust

Avoid general jewelers' saw classification

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