Gallium Arsenide Wafer Slicer from Japan
Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Note material brittleness requires lower blade speeds; document in technical specs
• Hazardous waste handling certification for gallium arsenide dust
• Avoid general jewelers' saw classification