Presses for the manufacture of particle board or fiber building board of wood or other ligneous materials and other machinery for treating wood or cork
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Presses for the manufacture of particle board or fiber building board of wood or other ligneous materials and other machinery for treating wood or cork
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8479.30.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It falls under HTS 8479.30.00.00 as machinery for processing semiconductor materials, akin to treating ligneous materials, per statistical notes on semiconductor manufacturing equipment.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline silicon by zone melting, avoiding contamination from crucibles. Classified under HTS 8479.30.00.00 for semiconductor material processing equipment as per statistical notes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Chemical Mechanical Planarization Tool
CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.
Gallium Arsenide Wafer Slicer
Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.
Wafer Edge Profiling Machine
Machines profile wafer edges to prevent chipping and enable handling during fabrication. Part of wafer preparation sequence under HTS 8479.30.00.00 statistical notes.
Crystal boule Grinder with Flats
Grinds precise flats on semiconductor boules indicating crystal orientation and doping type. Essential per statistical note (a)(ii)(A) for wafer preparation.
Automated Wafer Polishing Line
Integrated systems handling wafer loading, lapping, polishing, cleaning in sequence. HTS 8479.30.00.00 for complete wafer preparation equipment per statistical notes.
Sapphire Wafer Preparation Grinder
Grinds synthetic sapphire boules for LED/HB-LED wafer production. Statistical notes cover semiconductor materials processing including sapphire substrates.
SOI Wafer Bond Strength Tester
Tests bonded wafer strength after preparatory processing. Edge case under statistical notes bridging preparation and testing equipment.
Wafer Slicing Diamond Saw
Diamond wire or blade saws slice thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8479.30.00.00 covers this under statistical note (a)(ii)(B) for wafer slicing equipment.
Crystal Boule Grinder
Crystal boule grinders precisely shape semiconductor boules to exact diameters and grind flats indicating conductivity type. Under HTS 8479.30.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment.
Double-Sided Wafer Polisher
Double-sided polishers simultaneously polish both wafer surfaces to achieve mirror finish and total thickness variation <0.5μm. HTS 8479.30.00.00 per statistical note for critical wafer surface flatness preparation.
Silicon Ingot Grinder
Precision grinders shape silicon ingots to exact diameters with orientation flats for wafer slicing. HTS 8479.30.00.00 specifically covers crystal grinders per statistical note (a)(ii)(A).