Silicon Ingot Grinder
Precision grinders shape silicon ingots to exact diameters with orientation flats for wafer slicing. HTS 8479.30.00.00 specifically covers crystal grinders per statistical note (a)(ii)(A).
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general grinding machines for semiconductor materials
External cylindrical grinders have separate provisions.
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Import Tips & Compliance
• Specify grinding wheel composition (diamond/CBN) for silicon/gallium arsenide
• Include coolant filtration specs for silicon particle management
Related Products under HTS 8479.30.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It falls under HTS 8479.30.00.00 as machinery for processing semiconductor materials, akin to treating ligneous materials, per statistical notes on semiconductor manufacturing equipment.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline silicon by zone melting, avoiding contamination from crucibles. Classified under HTS 8479.30.00.00 for semiconductor material processing equipment as per statistical notes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Chemical Mechanical Planarization Tool
CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.
Gallium Arsenide Wafer Slicer
Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.
Wafer Edge Profiling Machine
Machines profile wafer edges to prevent chipping and enable handling during fabrication. Part of wafer preparation sequence under HTS 8479.30.00.00 statistical notes.